logo

Exhibition

Contact Us

Pinsheng Electronics Co.,Ltd

Circuit board factory PCB high frequency board material selection and production process method

Sep 18, 2018

Definition of PCB high frequency board


Circuit board factory, high frequency board refers to the special electromagnetic frequency circuit boards, used for high frequency (greater than 300 MHZ frequency or wavelength is less than 1 meter) and microwave (greater than 3 GHZ frequency or wavelength is less than 0.1 meters) in the field of PCB, is on the microwave base copper clad using common rigid circuit board manufacturing method of a part of the process or the use of special processing methods and the production of circuit boards.

Generally speaking, high frequency board can be defined as circuit board with frequency above 1GHz.

 blob.png


20140819102145 _48486. JPG


With the rapid development of science and technology, more and more equipment designs are applied in the microwave frequency band (> 1GHZ) or even above the millimeter wave field (30GHZ), which also means the frequency is higher and higher, and the requirement on the substrate of the circuit board is higher and higher.

For example, the substrate material needs to have excellent electrical performance and good chemical stability. With the increase of power signal frequency, the loss requirement on the substrate is very small, so the importance of high frequency plate is highlighted.

 


PCB high frequency board application area


Mobile communications products;

Power amplifier, low noise amplifier, etc.

Passive devices such as power dividers, couplers, diplexers and filters;

In the fields of automobile collision avoidance system, satellite system and radio system, the high frequency of electronic equipment is the development trend.


Classification of high frequency plates


Powder ceramics are filled with thermosetting materials

A. manufacturer:

Rogers 4350B/4003C

Arlon's 25N/25FR

The Taconic company's TLG series


B. processing method:

Similar to the epoxy/glass woven fabric (FR4) process, only the plates are brittle and easy to break, and the life of the drill heads and gongs is reduced by 20% when drilling and gongs.

 


PTFE(PTFE) material


A. manufacturer:

Rogers RO3000 series, RT series, TMM series

Arlon's AD/AR, IsoClad, CuClad

Taconic inc. 's RF series, TLX series, TLY series

Taixing microwave F4B, F4BM, F4BK, tp-2


B. processing method:


1. Material opening: the protective film shall be retained to prevent scratches and indentation


2. The drilling

1. Use the new drill nozzle (standard 130), one by one is the best, and the pressure of the presser foot is 40psi

2. The aluminum sheet is the cover plate, and then the PTFE plate is tightened with 1mm melamine pad

3. After drilling, blow out the dust in the hole with the air gun

4. With the most stable drilling rig, the drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the Chip load, and the smaller the recovery speed)


3. The hole processing

Plasma treatment or sodium naphthalene activation is beneficial for hole metallization


4. PTH sink copper

1 after microetching (the microetching rate is controlled by 20 micro inches), the PTH is pulled from the oil removal cylinder to enter the plate

2 if necessary, pass the second PTH.

Cylinder entry


5. The resistance welding

1 pre-treatment: acid wash board, not mechanical grinding board

2 after the pretreatment for board (90 ℃, 30 min), brush green oil curing

Three points three classes of board: a 80 ℃, 100 ℃, 150 ℃, each time 30 min (if you have found the substrate surface to jilt oil, can rework: wash the green oil, activation treatment again)


The gong plate 6.

Place the white paper on the line surface of the PTFE board and clamp the fr-4 substrate or phenolic substrate with a thickness of 1.0mm etching copper.


High frequency gong board lamination method


The rough edges of the rear boards of gongs need to be carefully repaired by hand to prevent damage to the base material and the copper surface, and then separated by a considerable size of sulfur free paper, and visual detection, to reduce burrs, the key is that the gongs have a good removal effect during the process.

 



The process flow

NPTH PTFE plate processing process

Blanking - drilling - dry film - inspection - etching - corrosion - soldering - character - spray tin - molding - testing - final inspection - packaging - shipment


PTH of PTFE plate processing process

Cutting - drilling - drilling - hole processing (plasma treatment or sodium naphthalene activation)- sinking copper - plate electrical - dry film - inspection - chart electrical - etching - erosion - soldering - character - soldering - molding - testing - final inspection - packaging - shipment


conclusion



Difficulty in high frequency plate machining


1. Copper sinking: the hole wall is not easy to be copper

2. Picture rotation, etching, line width gap and sand hole control

3. Green oil process: control of green oil adhesion and bubbling

4. Strictly control board surface scratches and so on in each process.


Related Industry Knowledge
Case Show
rigid Printed circuit board
flexible Printed circuit board
rigid flex Printed circuit board 
aluminum Printed circuit board
Information Center
PCB copper foil...
Printed circuit board...
Printed Circuit Board...
What are the benefits...
Latest News
Circuit Board
Features
Printed Circuit...
The Main Advantages...
Contact information
Pinsheng Electronics Co.,Ltd

Yinjin Building, Liuxian 2rd Road, 71 District of Xin'an, Bao'an District, Shenzhen, 518133, China

Tel: +86-0755-27322312

sales@pspcb.com

Copyright © Pinsheng Electronics Co.,Ltd All Rights Reserved.