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Common PCB materials

Aug 06, 2018

The main element is dielectric substrate which is rigid or flexible. This dielectric substrate is used with conducting material like copper on it. As dielectric material, the glass epoxy laminates or composite materials are used.

 

1) FR4:

FR is stand for FIRE RETARDENT. For all type of PCB manufacturing, most common glass laminated material is FR4. Based on woven glass-epoxy compounds, FR4 is a composite material which is most useful because it provides very good mechanical strength.

FR4

Glass transition temp


Standard

130

lMost common and widely used

lCheapest

With higher glass transition temp

170-180

lCompatible with the lead free reflow technology

Halogen free

--

lCompatible with the lead free reflow technology

 

2) FR-1 and FR-2:

This material is made from paper and phenol compounds and this material is used for only single layer PCB. Both FR1 and FR2 has similar characteristic, the only difference is glass transition temperature. FR1 has higher glass transition temperature compared to FR2. These materials is also sub divided in standard, halogen free and non-hydrophobic.

 

3) CEM-1:

These material is made from paper and two layer of woven glass epoxy and phenol compounds and this material is used for Single sided PCB only. CEM-1 can used instead of FR4, but price of CEM1 is higher than FR4.

 

4) CEM-3:

this material is white coloured, glass epoxy compound which is mostly used in double layer PCB. CEM-3 has lower mechanical strength compared to FR4, but it is cheaper than FR4. So, this is a good alternative of FR4.

 

5) Polyimide:

This material is used in flexible PCB. This material is made from kepton, rogers, dupont. This material has good electrical properties, felicity, wide temperature range and high chemical resistance. Working temperature of this material is -200 ͦC to 300 ͦC.

 

6) Prepreg:

Prepreg means pre-impregnated. It is a Fiberglass impregnated with resin. These resins are pre- dried, so that when it heated, it flows, sticks and completely immersed. Prepreg has adhesive layer which gives strength similar to FR4. There are many versions of this material according to resin content, SR- standard resin, MR- medium resin and HR- high resin. This is chosen according to required thickness, layer structure and impedance. This material also available in high glass transition temperature and halogen free.

 

Vendor Expansion:

 

Supplier
Laminate
Type
 

 

Aluminum Clad

Please call for details






ISOLA

370HR

FR4/Phenolic


 

185HR

FR4/Phenolic



ED130UV

FR4



FR406

FR4 High Temp



IS410

FR4 High Temp



408HR

FR4



IS620i

Modified Epoxy



P95

Polyimide



P96

Polyimide






NELCO

N4000-6

FR4 High Temp



N4000-11

Modified Epoxy



N4000-12 / 12 SI

Modified Epoxy



N4000-13 / 13 SI

Modified Epoxy



N4000-13 / 13 EP SI

Modified Epoxy



N4000-29

FR4 High Temp






ARLON

85N

Cer/Glass






ROGERS

RT/Duroid 5880

PTFE/Glass



RT/Duroid 5870

PTFE/Microfiber



RT/Duroid 6002

Cer/PTFE



RT/Duroid 6006

Cer/PTFE



RT/Duroid 6010

Cer/PTFE



3003

Cer/PTFE



3006

Cer/PTFE



3010

Cer/PTFE



3203

Cer/PTFE



3210

Cer/PTFE



4003C

Hydrocarbon/Cer



4350B

Hydrocarbon/Cer



4450B

Hydrocarbon/Cer






TACONIC

TLC

PTFE/Glass



TLE

PTFE/Glass



TLT

PTFE/Glass



TLX

PTFE/Glass


 


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Pinsheng Electronics Co.,Ltd

NO 1,Pinzhi Road,xin'an Industrial park,Wu sha community Chang'an District, Dongguan City, Guangdong Province China

Tel: +86-769-26990485

sales@pspcb.com

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