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PCB dry film when used hole / diffusion problems to improve the way

Jan 17, 2018

With the rapid development of the electronics industry, PCB layout more and more sophisticated, most PCB manufacturers use dry film to complete the transfer of graphics, the use of dry film is also more and more popular, but I am in the process of after-sales service, still encountered a lot Customers use dry film when there are many errors, are summed up in order to learn.


First, dry film hole hole appears broken


Many customers believe that the emergence of holes, the film should be increased temperature and pressure to enhance its binding force, in fact, this view is not correct, because the temperature and pressure is too high, the solvent resist excessive evaporation, so dry Film brittle thinning, easy to be punched when developing, we always have to maintain the toughness of the dry film, so the emergence of holes, we can do from the following points to improve:


1, reduce foil temperature and pressure

2, improve drilling holes

3, improve exposure energy

4, reduce development pressure

5, post-filming time can not be too long, so as to avoid the corner of the semi-fluid-like film diffusion under the action of the pressure thinning

6, filming process dry film do not get too tight


Second, dry plating occurs when plating


The reason why the infiltration plating, indicating that the dry film and the copper clad plate bond is not strong, so that the bath in-depth, resulting in "negative phase" part of the coating thickening, the majority of PCB manufacturers occur infiltration are caused by the following:


1, high or low exposure energy


Under ultraviolet light, the photoinitiator that absorbs the light energy is decomposed into radical-initiated monomers for photopolymerization to form a body-type molecule that is insoluble in a dilute alkali solution. Exposure is not enough, due to incomplete polymerization, in the development process, the film swelling becomes soft, resulting in lines are not clear or even the film off, resulting in poor film and copper bonding; if the exposure will cause difficult to develop, but also in the plating process In the resulting Alice peeling, the formation of infiltration. So controlling the exposure energy is very important.


2, foil temperature is high or low


If the film temperature is too low, the resist film is not fully softened and properly flowed, resulting in poor adhesion of the dry film to the surface of the copper clad laminate; if the temperature is too high, solvents and other volatiles in the resist Rapid volatilization of substances and the formation of bubbles, and dry film becomes brittle, the formation of electrosurgical peel Alice off, resulting in infiltration.


3, foil pressure is high or low


Foil pressure is too low, it may result in uneven film surface or dry film and the gap between the copper plate to meet the requirements of the bonding force; foil pressure is too high, the resist layer of volatile solvents and volatile too much material, resulting in Dry film brittle, electroplated shock will peel off.


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Pinsheng Electronics Co.,Ltd

NO 1,Pinzhi Road,xin'an Industrial park,Wu sha community Chang'an District, Dongguan City, Guangdong Province China

Tel: +86-769-26990485

sales@pspcb.com

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