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What are the differences between PCB positive and negative output processes?

May 10, 2017

Negative: Generally we are talking about the tenting process, the use of liquid for the acid etching

Negative film is produced because the film, the line or copper surface is transparent, and not part of the black or brown, after the line process exposure, the transparent part of the dry film resistance by the light from the chemical effect Hardening, the next development process will not harden the dry film washed away, so in the etching process only bite dry film washed away part of the copper foil (black or brown part of the film), while the dry film is not (The transparent part of the film), after leaving the film we need to leave the line, in this process in the film to cover the hole, the exposure requirements and the requirements of the film slightly higher Some, but its manufacturing process is fast.

Positive film: We usually say the pattern process, the use of liquid for alkaline etching

Positive film if the film to see, to the line or copper surface is black or brown, and not part of the transparent, the same after the line process exposure, the transparent part of the dry film resistance by the light from the chemical effect Hardening, the next development process will not harden the dry film washed away, followed by tin-tin lead process, the tin lead in the previous process (development) dry film washed off the copper surface, and then to the membrane Action (to remove the dry film due to light), and in the next process etching, with alkaline medicine bitter no tin-lead protection of copper foil (film transparent part), the rest is the line we want (film Black or brown part).

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