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5G Copper Clad Board With Resin

Oct 30, 2018

The commercial application of 5G communication standard is ready to be launched.

China's overall market investment in 5G industry will exceed us $1 trillion in the next five years, according to a report by a multinational research institute.

The advent of 5G era will greatly promote the rapid growth of electronic chemicals, special resins and other related market consumption.

As a kind of "reinforced concrete" in the electronics industry, the copper clad laminate (referred to as copper clad laminate) market is facing a new round of outbreak. The special resin for copper clad laminate, which takes up a quarter of the raw materials, has also become one of the technologies in urgent need of development in the petrochemical industry.


The performance of copper clad plate depends largely on the selection of special resin.

Based on the high purity, low moisture absorption and certain mechanical properties of epoxy resin required for traditional copper clad plates, 5G copper clad plates put forward higher requirements for epoxy resin, such as high heat resistance, low water absorption, low dielectric, good weather resistance and green environmental protection.

Raise glass temperature of resin

High heat resistance depends on the high glass transition temperature (Tg), the current average FR - 4 copper clad Tg at 130 ℃ ~ 140 ℃, and there are several in PCB manufacturing process over the temperature range, thus high Tg how to increase the heat resistant epoxy resin frame or increase the crosslinking density of polyfunctional epoxy resin research and development is very important for the development of copper clad.

FR - 4 copper clad using difunctional brominated bisphenol A type epoxy resin, in order to improve the matrix Tg will join nuo fu, epoxy resin, novartis v due to the structure, epoxy resin containing epoxy group, the matrix properties, such as heat resistance have increased significantly, but the brittleness product is bigger, bonding is poorer, the production of epoxy resin copper clad laminates is generally not used alone.

In addition, phenolic epoxy resin, biphenyl type, epoxy containing naphthalene structure have been applied in a certain range of high Tg.

Lower the substrate dielectric constant

Low dielectric constant is also an important index of copper clad sheet.

The lower the permittivity of the substrate, the faster the signal transmission speed will be. In order to achieve the high-speed transmission of the signal, the plate with low permittivity must be selected. However, the epoxy resin dielectric constant used for fr-4 copper clad plate is too high at present, which makes it difficult to meet the use of high frequency circuit.

Polytetrafluoroethylene is used in most of the high frequency circuits. Although polytetrafluoroethylene has excellent dielectric properties, compared with epoxy resin, it has poor processability, poor comprehensive performance and high cost.

Although the dielectric constant and dielectric loss Angle are relatively high, epoxy resin has the advantages of good processing, excellent comprehensive performance, suitable price and sufficient supply.

If the modified method is used to introduce groups with small polarity and large volume into the structure of epoxy resin, the dielectric properties of the resin can be improved.

Epoxy resin with low dielectric constant can be prepared by introducing alkyl groups into epoxy resin structure or using lipocyclic modified phenolic resin, cyanate resin reacting with epoxy resin, or etherifying epoxy resin.

Use halogen-free flame retardant

In the aspect of green environmental protection, the flame retardant of traditional copper clad laminates is realized through the brominated epoxy resin and halogen curing agent in the adhesive, among which the bromine content in epoxy resin is about 12%~50%.

The eu RoHS directive prohibits the use of polybrominated biphenyls and polybrominated biphenyl ethers in electronic products. In addition, some studies have found that brominated flame retardants release substances harmful to human body and environment during combustion. Therefore, in recent years, the electronic machine has put forward halogen-free requirements for copper clad plates.

The development of halogen-free flame retardant copper clad sheet has become an important subject in the industry.

In addition to the consideration of the elements with flame retardant function, other elements such as N and P of V group can also be adopted.

It is proved by experiments that the flame retardant effect can be satisfied by the introduction of N and P into the epoxy resin system with appropriate flame retardant.

Flame retardant epoxy resin without phosphorus, nitrogen and halogen-free will become a great demand for copper clad laminates. It is expected to be realized through the self-flame retardant function of epoxy resin itself or the addition of inorganic flame retardant composition. In addition, silicone modified epoxy resin is also applied in the halogen-free copper clad laminates.

Domestic enterprises are active in research and development

The research on epoxy resin in China started early. In addition to common bisphenol A type epoxy resin, various types of special epoxy resin were produced.

In recent years, related enterprises in China have also made some breakthroughs in special resins for copper clad laminates.

Shengyi technology (600183) is the company with the most complete specifications of copper clad laminates in China, but it still produces various fr-4, cem-1, cem-3 and other composite copper clad laminates mainly, with multiple high-frequency and high-speed product systems.

In 2016, shengyi technology invested in jiangsu special materials, which is expected to achieve a capacity of 88,000 cubic meters/month of PTFE materials after delivery.

In the 5G cycle, shengyi technology will realize the localization of high frequency/high speed plate scale through cost advantages and the joint efforts of downstream equipment manufacturers and local leading PCB processing manufacturers.

In addition, the reporter also learned that baling petrochemical epoxy resin department adopted its own research and development of DCPD phenol epoxy resin to develop the pilot test product quality index is stable, with low dielectric constant and low medium loss Angle tangent, passed the 5G product test of several 5G communication manufacturers.

The industrialization of the DCPD phenol epoxy resin products has begun and is expected to be completed by the end of this year.

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